- Product
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
Semiconductor SiC Wafer Cutting Products
SY-IT585N(Semiconductor Sic Wafer CUTTING OIL)
SY-IT585N is a fat-soluble cutting fluid for semiconductor SiC Wafer Sawing, mainly composed of naphthene-based oil, has excellent viscosity maintenance, wire adhesion, phase separation, and compression sedimentation effects of slurry, and has excellent lubrication and extreme pressure. This product has excellent lubrication, thermal stability, and oxidation stability, so it is used as a CUTTING OIL for SiC WAFER's WIRE-SAW cutting process.
Product Sacred Image
| Product Type | Transparent Colorless |
|---|---|
| Appearance | yellow liquid |
| pH(25℃) | 7.0~8.0 |
| Density(25℃, g/㎤) | 0.85~0.95 |
| Viscosity(mPas)(25℃) | 60~80 |
Product Advantage
- Its excellent thermal stability prevents the performance of OIL from being degraded by high-temperature exposure, allowing it to be used at higher temperatures.
- Excellent oxidation stability is formed and there is no OIL damage caused by acidic substances.
- Excellent lubrication and anti-slurry sinking effect.
- Excellent wear resistance and lubrication properties.
- Coolability increases yield.
- Low OIL evaporation and high temperature fluidity do not affect viscosity and viscosity index changes.
Purpose
CUTTING OIL FOR WIRE SAW CUTTING PROCESS OF SIC WAFER