- Product
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
Semiconductor Silicon Wafer Cutting Products
SY-MAX300R,
SY-MAX300H SY-IT585N SY-EDR600,
SY-EDR630 SY-H813 SY-AC1000
SY-BC529 SY-IT515
SY-EDRON 100SY-GP515
SY-MAX300R, SY-MAX300H (Cut OIL for Semiconductor Wafer Polishing)
SY-MAX300R, SY-MAX300H is based on soluble oil
compounds and is developed to best suit the wire saw equipment for Silicon
ingot sliding. This product can be used as lubrication, coolant, and lubrication
of cutting equipment for Silicon ingot, quartz, sapfire and electronic
semiconductors.
Product Sacred Image
| Product Type | Test Results | |
|---|---|---|
| Appearance | Transparent Colorless | |
| pH(25℃) | 6.0~8.0 | |
| Density(25℃, g/㎤) | 1.05±0.05 | |
| Viscosity(mPas)(25℃) | 22±5 | |
Product Advantage
- It is soluble after sliding, making it easy to
clean.
- Slurry has a long lifespan and low replenishment.
- Maintaining a constant viscosity, there is little change in viscosity.
- Having excellent biodegradability.
- Easy to dispose of waste water/waste.
- High dispersion during grinding to maintain uniformity of slurry and do not give hard cakeability.
- As the coefficient of friction is low, the Wafer flatness (decompression phenomenon) is improved.
- Slurry viscosity can be changed depending on the sliding machine.
- The recovery rate of abrasives and coolants in the use of resilk is high and thermal conductivity is excellent.
- Slurry has a long lifespan and low replenishment.
- Maintaining a constant viscosity, there is little change in viscosity.
- Having excellent biodegradability.
- Easy to dispose of waste water/waste.
- High dispersion during grinding to maintain uniformity of slurry and do not give hard cakeability.
- As the coefficient of friction is low, the Wafer flatness (decompression phenomenon) is improved.
- Slurry viscosity can be changed depending on the sliding machine.
- The recovery rate of abrasives and coolants in the use of resilk is high and thermal conductivity is excellent.
Purpose
Packing
- 200KG PE Drum, 1000KG IBC Tank