Semiconductor Silicon Wafer Cutting Products



SY-AC1000 (Killate)


SY-AC1000 is used in the post-chemical polishing process of wafers containing anti-corrosion agents and tungsten, is alkaline with negative embellishment potential to prevent oxidation and corrosion of tungsten, and improves defects in the post-process without etching metals, leaving deposits or contaminating wafers.

Product Sacred Image
Appearance amber transparent liquid
pH(25℃) 4.0~5.5
Density(25℃, g/㎤) 1.20±0.05(25℃)


Product characteristics
- SY-AC1000 effectively disables heavy metal ions such as Fe, Cu and Ni, as well as Ca, in a wide pH range, to prevent problems caused by metal ions contained in water.
- Almost all metal ions, including Cu and Ni, and stable kilolites are formed to separate and remove most metal ions.
- The ability to form metals and flammable compounds is excellent, reducing the amount of metal that penetrates into semiconductor wafers.
- Metal salts and strong dispersion effects effectively remove impurities from pretreatment without leaving any contaminants to prevent reattachment.
- As a scale inhibitor, it combines with ions from Fe, Mg, Ca, and other metals to enhance the cleaning effect.

Purpose
용도

Packing
- 1000kg IBC Tank, 200kg PE Drum