SY-AC1000 is used in the post-chemical polishing process of wafers containing anti-corrosion agents
and tungsten, is alkaline with negative embellishment potential to prevent oxidation and corrosion of tungsten,
and improves defects in the post-process without etching metals, leaving deposits or contaminating wafers.
Appearance |
amber transparent liquid |
pH(25℃) |
4.0~5.5 |
Density(25℃, g/㎤) |
1.20±0.05(25℃) |
Product characteristics
- SY-AC1000 effectively disables heavy metal ions
such as Fe, Cu and Ni, as well as Ca, in a wide pH range, to prevent
problems caused by metal ions contained in water.
- Almost all metal ions, including Cu and Ni, and stable kilolites are
formed to separate and remove most metal ions.
- The ability to form metals and flammable compounds is excellent, reducing
the amount of metal that penetrates into semiconductor wafers.
- Metal salts and strong dispersion effects effectively remove impurities
from pretreatment without leaving any contaminants to prevent reattachment.
- As a scale inhibitor, it combines with ions from Fe, Mg, Ca, and other
metals to enhance the cleaning effect.
Purpose
Packing
- 1000kg IBC Tank, 200kg PE Drum