Semiconductor Silicon Wafer Cutting Products



SY-IT585N (Cutting OIL for Semiconductor 200mm Wafer Wire-Saw)


SY-IT585N is a product developed to best suit WAFER WIRE-SAW equipment based on fat-soluble oil. This product is used as a CUTTING oil of the WIRE-SAW cutting process of 200 mm WAFER because of its excellent lubrication, thermal stability, and dispersion.



Product Sacred Image
Product Type Test Results
Appearance Opaque Yellow Liquid
pH(25℃) 7.0±1.0
Density(25℃, g/㎤) 0.85±0.1
Viscosity(mPas)(25℃) 72±3


Product Advantages
- Excellent ability to form copper (Cu) and compounds to reduce the copper content penetrating Wafer.
- Prevent metal ions such as F2+F3+.
- OIL evaporation and reduction are low and high temperature liquidity is excellent, which does not affect viscosity and viscosity index changes.
- Good wear resistance.
- Excellent lubrication to prevent Scratch and Slurry residue attachment to Wafer surface.
- Excellent cooling and sealing to increase yield.

Purpose
200mm WIRE-SAW cutting process of WAFER CUTTING OIL

Packing
- 200KG PE Drum, 1000KG IBC Tank