- Product
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
- Semiconductor Silicon Wafer Cutting Products
Semiconductor Silicon Wafer Cutting Products
SY-GP515 (Cleaning agent for semiconductor wafer polishing process)
SY-GP515 is a cleaning agent developed to be suitable for cleaning after polishing the SiC process.
This product is a cleaning agent in the field of semiconductor wafers and electromechanical components and has an excellent effect on cleaning organic contaminants, metal contaminants, particles, and oxide films
Product Sacred Image
| Product Type | Test Results | |
|---|---|---|
| Appearance | transparent liquid |
|
| pH(25℃) | 12±0.5 |
|
| specific gravity(@25℃) | 1.1±0.1 |
|
Product Advantages
It is a low-foam surfactant with high permeability and low surface tension, and has excellent cleaning power.
Because of its excellent hydrophilicity, it is easy to rinse and does not cause stains.
After cleaning the semiconductor WAFER, there is no surface contamination residue, and the process is not affected, so the WAFER surface defect rate can be reduced.
Purpose
- 150mm Wafer polishing process cleaner