- Product
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
- Semiconductor SiC Wafer Cutting Products
Semiconductor SiC Wafer Cutting Products
SY-AC1000 (Semiconductor SiC Wafer chelating agent)
SY-AC1000 is used in the cleaning process after chemical mechanical polishing of SiC Wafer containing tungsten and containing anti-corrosion agents, is alkaline with negative sintering potential, prevents oxidation and corrosion of tungsten, and does not etch metal, leave deposits, or contaminate SiC Wafer, It improves the defects that will occur in the post-process.
Product Sacred Image
| Appearance | yellow liquid |
| pH(25℃) | 7.0~8.0 |
| Viscosity(mPas)(25℃) | 1.20±0.05(25℃) |
Product Advantage
- SY-AC1000 effectively deactivates heavy metal ions such as Fe, Cu, and Ni as well as Ca over a wide pH range to prevent problems caused by metal ions contained in water.
- It forms a stable chelate with almost all metal ions, including Cu and Ni, enabling the separation and removal of most metal ions.
- Excellent ability to form compounds with metals reduces the content of metal penetrating the semiconductor SiC Wafer.
- Metal salt chelating and strong dispersion effect effectively remove impurities without leaving any contaminants during pretreatment to prevent re-adhesion.
- Combines with ions from Fe, Mg, Ca and other metals as scale inhibitors to increase cleaning effect.
Purpose
Metal ion sealants (cheating agents), semiconductor cleaning agents, wafer pre-etching agents, antioxidants and corrosion inhibitors